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BICHENG ENTERPRISE LIMITED
BICHENG ENTERPRISE LIMITED Specialized in heavy copper PCBs for 15 years High Frequency PCB | Metal Core PCB | Flexible PCB 90% export | UL, ISO 9001, ISO14001 and TS 16949 certified
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RF PCB Board Built On RO4350B 30 mil With Immersion Gold

RF PCB Board Built On RO4350B 30 mil With Immersion Gold

Brand Name : Bicheng Enterprise Limited
Model Number : BIC-0430-V4.30
Certification : UL
Place of Origin : China
MOQ : 1
Price : USD40~50
Payment Terms : T/T, Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 5-6 working days
Packaging Details : Vacuum
Board Material : RO4350B Rogers Corp 280℃
Surface Cu thickness : 35 um (1oz)
Board Thickness : 0.60 mm +/-0.06
Surface Finish : Immersion Gold
Solder Mask Colour : NA
Color of Silkscreen : NA
Function : 100% Pass electrical test
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Product profile
1.1 General description
This is a type of double sided high frequency PCB built on RO4350B 30 mil
substrate for the application of antenna. It's a 2 layer RF PCB board at 0.9mm
thick. It's immersion gold finish without solder mask. It's fabricated per IPC 6012
Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.
1.2 Features and benifits
A. Delamination of copper foil will not be caused by the change of cold and heat
due to the consistency with the thermal expansion coefficient of copper foil.
B. Stable electrical coefficient of dielectric constant.
C. Heat resistance, chemical resistance, impact strength and peeling strength are
good.
D. Immersion gold has excellent surface planarity, particularly helpful for PCBs with
BGA packages or even CSP mounted components to reduce failure rate during
assembly and soldering.
E. Whole fabrication process are totally controlled.
F. Thermal stress test, reliability test, insulation resistance test and ionic contamination
test,
G. 1-10 pieces are offered .
H. Reduce manufacturing cost from advanced equipment import, worker training and
technology improvement and management.
I. UL conformed
1.3 Application
Balanced mixer, Multicoupler combiner, Tower-mounted booster, Power amplifier
1.4 Parameter and data sheet
Number of Layers2
Board TypeHigh Frequency PCB
Board size67 x 17 mm =1up
Board Thickness0.60 mm +/-0.06
Board MaterialRO4350B
Board Material SupplierRogers Corp
Tg Value of Board Material280℃
PTH Cu thickness≥20 um (See hole wall details)
Inner Iayer Cu thicknesN/A
Surface Cu thickness35 um (1oz)
Solder Mask Type and Model No.NA
Solder Mask SupplierNA
Solder Mask ColourNA
Number of Solder MasksNA
Thickness of Solder MaskNA
Type of Silkscreen Ink
Supplier of SilkscreenNA
Color of SilkscreenNA
Number of SilkscreenNA
Mininum Trace (mil)7.87 mil
Minimum Gap(mil)5.9 mil
Surface FinishImmersion Gold
RoHS RequiredYes
Warpage0.56%
Thermal Shock TestPass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity TestPass, 255±5℃,5 seconds Wetting Area Least 95%
Function100% Pass electrical test
WorkmanshipCompliance with IPC-A-600H & IPC-6012C Class 2


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